Title:
導電性基板、導電性基板の製造方法
Document Type and Number:
Japanese Patent JP6705455
Kind Code:
B2
Abstract:
Provided is a conductive substrate having: a transparent base; a metal layer formed on at least one surface of the transparent base; a protective layer formed on the metal layer, the protective layer containing an organic compound that includes sulfur atoms and/or nitrogen atoms; and a blackening layer formed on the protective layer.
Inventors:
Shiki Taiki
Hiroki Hata
Yoshihide Nishiyama
Takahiro Suda
Yusu
Sowa
Zhimei Hu
Arima Hironobu
Hiroki Hata
Yoshihide Nishiyama
Takahiro Suda
Yusu
Sowa
Zhimei Hu
Arima Hironobu
Application Number:
JP2017532529A
Publication Date:
June 03, 2020
Filing Date:
July 27, 2016
Export Citation:
Assignee:
Sumitomo Metal Mining Co., Ltd.
International Classes:
G06F3/041; B32B7/023; B32B15/04; C23C14/02; G06F3/044; H01B5/14; H01B13/00
Domestic Patent References:
| JP2013228986A | ||||
| JP2014219963A | ||||
| JP201685598A |
Foreign References:
| WO2016017773A1 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito