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Title:
伝導性熱可塑性ポリアミド成形コンパウンド
Document Type and Number:
Japanese Patent JP7082605
Kind Code:
B2
Abstract:
The invention relates to a polyamide moulding compound consisting of the following components: (A) 35-68 wt. % of at least one semi-crystalline, semi-aromatic, thermoplastic polyamide based on aliphatic diamines with 4-8 carbon atoms with a melting temperature of at least 270° C.; (B) 15-22 wt. % carbon fibres; (C) 18-30 wt. % glass fibres; (D) 1-10 wt. % of an impact-resistance modifier that is different from (E) and/or polymers that are different from (A), (E) and (F); (E) 0-10 wt. % ethylene-vinyl acetate copolymer; and (F) 0-3 wt. % additives. In this way, the sum of the components (A)-(F) is 100 wt. %, the sum of the components (B)-(C) is in the range of 33-48 wt. %, and the sum of the components (D)-(E) is in the range of 2-12 wt. %. The moulding compound permits the production of dimensionally stable, electrically conductive components, e.g. for the automotive sector and for contact with fuels, in particular methanol-containing petrol.

Inventors:
Lumberts Nikolai
Bayer Andreas
Application Number:
JP2019501467A
Publication Date:
June 08, 2022
Filing Date:
July 10, 2017
Export Citation:
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Assignee:
ASM-Patent Akchen Gezel Shaft
International Classes:
C08L77/06; C08K3/04; C08K7/06; C08K7/14; C08L21/00; C08L31/04; C08L53/00
Domestic Patent References:
JP2016074903A
JP7207154A
JP2009079212A
Foreign References:
WO2015011935A1
Attorney, Agent or Firm:
Shinichiro Tanaka
Teshimaru Ken
Yoshi Kazuhiko Ta
Atsushi Hakoda
Kenji Asai
Kazuo Yamazaki
Satsuki Ichikawa
Hironobu Hattori
Nanae Matsuda