To provide a conductor composition for multilayered ceramic substrate from which a multilayered ceramic substrate causing no defect in the vicinities of electrodes after baking can be manufactured.
The multilayered ceramic substrate is manufactured by laminating green sheets composed of a ceramic which is not sintered at the baking temperature of a laminate upon both surfaces of the laminate after the laminate is formed by laminating a plurality of green sheets composed of a glass ceramic and having internal wiring patterns on their surfaces upon another and baking the laminate. At the time of manufacturing the substrate, the via holes of the green sheets composed of the glass ceramic are filled up with the conductor composition for multilayered ceramic substrate. The composition is composed of conductive powder of at least one kind of metal selected from among Ag, Au, Pt, and Pd and contains an Mo compound or Mo metal as an essential ingredient in an amount of 0.05-10 pts.wt. in terms of Mo metal in 100 pts.wt. of the powder.
KATSUMURA HIDENORI
KAGATA HIROSHI
OGURA SHINICHI
SUEHIRO MASATOSHI
KYOTO ELEX KK
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