導体ペースト - Shoei Chemical Industry Co., Ltd.

Title:

導体ペースト

Document Type and Number:

Japanese Patent JP5056828

Kind Code:

B2

Abstract:

To provide a conductor paste which can form a terminal electrode being dense, having high adhesion to an element assembly, being very excellent in plating solution resistance, and being capable of coping with thickness reduction.

The conductor paste comprises a conductive powder, glass powder and organic vehicle, wherein the glass powder comprises, in terms of oxides, 42.0-65.0% by weight of SiO2, 8.0-18.0% by weight of R2O, in which R is an alkali metal, 4.0-20.0% by weight of R'O, in which R' is an alkaline earth metal, 0-18% by weight of B2O3, 3.0-18.0% by weight of Al2O3, and 0-15% by weight of La2O3, and satisfies the following formula (1) (R2O+R'O+B2O3)/SiO2≤0.95.

Inventors:

Naoto Shindo
Kawahara Megumi
Ohta Nosei

Application Number:

JP2009236914A

Publication Date:

October 24, 2012

Filing Date:

October 14, 2009

Export Citation:

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Assignee:

Shoei Chemical Industry Co., Ltd.

International Classes:

C03C8/18; C03C8/02; H01G4/232

Domestic Patent References:

JP9161539A
JP2004228093A

Attorney, Agent or Firm:

Masami Sakai
Norio Kagami
Hidetake Komatsu

Previous Patent: JPS5056827

Next Patent: JPS5056829