Title:
導電体基板、導電体基板の製造方法、デバイス及び電子機器
Document Type and Number:
Japanese Patent JP5518355
Kind Code:
B2
Inventors:
Shoichiro Nakao
Naomi Yamada
Taro Ichisugi
Tetsuya Hasegawa
Naomi Yamada
Taro Ichisugi
Tetsuya Hasegawa
Application Number:
JP2009077252A
Publication Date:
June 11, 2014
Filing Date:
March 26, 2009
Export Citation:
Assignee:
Kanagawa Academy of Science and Technology
International Classes:
H01B5/14; B32B15/04; C01F5/28; C01G19/02; C01G23/04; C01G33/00; C01G35/00; C03C17/34; G02F1/1343; G09F9/30; H01B13/00; H01J9/02; H01J11/22; H01J11/34
Domestic Patent References:
| JP61227946A | ||||
| JP63301415A | ||||
| JP2004010910A | ||||
| JP2005011737A | ||||
| JP7073738A | ||||
| JP2009231213A |
Foreign References:
| WO2009028569A1 | ||||
| WO2009119273A1 |
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Takashi Watanabe
Suzuki Mitsuyoshi
Kazuya Nishi
Yasuhiko Murayama
Tadashi Takahashi
Takashi Watanabe
Suzuki Mitsuyoshi
Kazuya Nishi
Yasuhiko Murayama