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Patent Searching and Data


Title:
CONNECTING DEVICE FOR CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2009170415
Kind Code:
A
Abstract:

To provide a connecting device for circuit board capable of being reduced in size.

The connecting device 10 for circuit board connects a pair of circuit boards 1, 2 with an adhesive 3, by pressurizing the pair of circuit boards 1, 2 with the adhesive 3 in between. The connecting device 10 for circuit board is provided with a pressure arm 12, with a pressure tool 14 mounted at one end side; a bracket side arm 16 with a bracket side tool 18 mounted at on end side; and a coupling member 20, coupling the other end side of the pressure arm 12 and the other end side of the bracket side arm 16. The pressure arm 12 and the bracket side arm 16 are set turnable, at a connection point with the coupling member 20 as a center. The pressure tool 14 and the bracket side tool 18 are mounted on the pressure arm 12 and the bracket side arm 16, respectively so that the one end side of the pressure arm 12 and the one end side of the bracket side arm 16 face close to each other.


Inventors:
ICHIMURA TAKEYUKI
TSUKAGOSHI ISAO
Application Number:
JP2008324151A
Publication Date:
July 30, 2009
Filing Date:
December 19, 2008
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H01R43/22
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Toshiaki Matsuzawa