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Title:
CONNECTING DEVICE AND ITS MANUFACTURE METHOD
Document Type and Number:
Japanese Patent JP3795898
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a connecting device which can be improved both in the conductivity and resiliency of a contact coming into contact with the external connecting part of an IC (integrated circuit) or the like, and manufacturing method thereof.
SOLUTION: The upper face, lower face, and both side faces of a conductive member 40 are completely covered with an auxiliary resilience member 41. The conductive member 40 comprises a material having a specific resistance lower than that of the auxiliary resilience member 41. The auxiliary resilience member 41 comprises a material having a yield point and elastic modulus both higher than those of the conductive member 40. Thereby, both the conductivity and resiliency of a spiral contact can be well improved.


Inventors:
Shinichi Nagano
Yoshida Shin
Koji Dono
Shuichi Chiba
Application Number:
JP2004149846A
Publication Date:
July 12, 2006
Filing Date:
May 20, 2004
Export Citation:
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Assignee:
ALPS ELECTRIC CO.,LTD.
International Classes:
G01R1/073; H01R33/76; H01R13/03; H01R13/24; H01R43/16; (IPC1-7): H01R33/76; G01R1/073; H01R13/03; H01R13/24; H01R43/16
Domestic Patent References:
JP2004012357A
JP2002175859A
JP2003171790A
JP2003142189A
JP2000144482A
JP11273818A
Attorney, Agent or Firm:
野▲崎▼ 照夫