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Patent Searching and Data


Title:
CONNECTING MATERIAL
Document Type and Number:
Japanese Patent JP2001081438
Kind Code:
A
Abstract:

To obtain a connecting material which is used for connecting members to be connected having electrodes facing to each other and exhibits high bonding strength and high electrical connection reliability by incorporating an adhesive component containing a thermosetting resin into the same and by specifying the elastic modulus at a specified temperature after being cured, the glass transition point and the tensile elongation.

This connecting material has an elastic modulus (at 30°C, after being cured) of 0.9-3 GPa, a glass transition point of 100°C or higher and a tensile elongation of 3% or higher. Preferably, the adhesive component contains a thermoplastic resin having a glass transition point of 50°C or lower and/or fine elastomer particles having an average particle size of 30-300 nm in an amount of 1-90 wt.%. The incorporation of 0-40 vol.% conductive particles into the adhesive component is preferable. The tensile elongation is preferably 6% or higher. The thermosetting resin used for the adhesive component is an epoxy resin, a urethane resin, a phenol resin or the like and, when used jointly with a curing agent, is cured by heating or by the irradiation with light, such as ultraviolet rays.


Inventors:
TAKECHI MOTOHIDE
YAGI HIDEKAZU
SUEMASA KAORI
Application Number:
JP26109599A
Publication Date:
March 27, 2001
Filing Date:
September 14, 1999
Export Citation:
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Assignee:
SONY CHEMICALS
International Classes:
H01R11/01; C09J5/06; C09J7/10; C09J201/00; H01B1/22; H01R4/04; H01R4/58; C08L63/00; (IPC1-7): C09J201/00; H01R4/04; H01R11/01
Domestic Patent References:
JP2001085083A2001-03-30
JPH0620519A1994-01-28
JPH10298525A1998-11-10
JPH11185526A1999-07-09
JPH08127707A1996-05-21
JPH07173448A1995-07-11
JPH11134934A1999-05-21
JP2000040418A2000-02-08
JPH11329069A1999-11-30
Foreign References:
WO1998003047A11998-01-22
Attorney, Agent or Firm:
Yanagihara