Title:
CONNECTING MEAHOD FOR MATERIAL
Document Type and Number:
Japanese Patent JPS5377957
Kind Code:
A
Abstract:
PURPOSE:To improve the adhesion strength and the accuracy of centering, by cuttin grooves at a fitting-in surface of the either one material and filling and adhesive agent in the said grooves, relating to the structure which is composed in such a manner that a pair of materials, at least the either one of which is cylindrical, are insertedly connected.
Inventors:
YAMANAKA TOSHIROU
Application Number:
JP15050176A
Publication Date:
July 10, 1978
Filing Date:
December 15, 1976
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
F16B11/00; (IPC1-7): F16B11/00