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Patent Searching and Data


Title:
CONNECTING STRUCTURE AND CONNECTION METHOD OF CIRCUIT BOARD AND SURFACE-MOUNTING CONNECTOR, AND STORAGE DEVICE EQUIPPED WITH THE CONNECTION STRUCTURE
Document Type and Number:
Japanese Patent JP2006253052
Kind Code:
A
Abstract:

To provide a connection structure and a connection method of a circuit board and a surface-mounting connector, in which the manufacturing cost can be reduced by facilitating insertion and extraction of a cable and by reducing component mounting process in the circuit board, and to provide a storage device having this connecting structure.

A through hole 111 is formed on an operation board 110 and a surface-mounting connector 120 is fixed, in a state of being engaged in the through hole 111 from the mounting face 110 side, and by applying a reflow solder treatment on the mounting face 110a, the surface-mounting connector 120 is connected to the operating board. Thereby, a plugging portion 123 of the connector can be arranged on the rear-face 110b side of the operating board 110, and soldering of the surface mounting connector 120 can be made by reflow solder treatment. As a result, component-mounting process in the operating board 110 is reduced, and manufacturing cost can be reduced.


Inventors:
TERAJIMA TAKESHI
Application Number:
JP2005070426A
Publication Date:
September 21, 2006
Filing Date:
March 14, 2005
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
H01R12/71; B41J29/00; H01R43/00; H05K1/18; H05K3/34
Attorney, Agent or Firm:
Kiyoshi Kurihara