Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CONNECTING TAPE FOR AUTOMATIC GANG BONDING
Document Type and Number:
Japanese Patent JPS614263
Kind Code:
A
Abstract:

PURPOSE: To perform continuous tests, inspections and the like of an electric circuit, by filling plastics to a hole, which is provided at a head part of a support lead as a unitary body, firmly holding each half-finished product, and feeding the half-finished product in a tape shape.

CONSTITUTION: A support lead 12 is protruded to the inside from a metal tape 2. The support lead 12 has a leg part 12a, which is linked to the metal tape 2, a head part 12b, which is linked to the leg part 12a and a hole 12c at the approximately central part. A connecting tape for automatic gang bonding 1 comprising the metal tape 2 is continuously fed to a bonding process. Each inner lead part 10a is connected to an electrode 8a of a semiconductor element 8. The head part 12b of the support lead is not contacted with the semiconductor element 8 but terminated before the element 8. Plastic sealing is performed on the half-finished product, whose bonding is finished. In the support lead 12, the head part 12b and the hole 12c are filled with plastics, and the bonding becomes extremely rigid.


Inventors:
OOKI KAZUO
NAKAYAMA KOUICHI
UEHARA KENICHI
Application Number:
JP12441084A
Publication Date:
January 10, 1986
Filing Date:
June 19, 1984
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NIPPON MINING CO
International Classes:
H01L21/60; (IPC1-7): H01L23/48
Attorney, Agent or Firm:
Akira Kurahashi