Title:
半導体パワーモジュールのための接続配置
Document Type and Number:
Japanese Patent JP5744742
Kind Code:
B2
Abstract:
A semiconductor power module (100) includes at least two sub modules (101-106). The sub modules (101-106) include at least one respective transistor (107) having a collector (108), an emitter (109) and a gate (110). Furthermore a connection arrangement is provided which includes a collector terminal unit (201) adapted for connecting the collectors of the at least two sub modules (101-106) collectively to external circuit components, at least two emitter terminal units (301-304) adapted for connecting the respective emitters (109) of the at least two sub modules (101-106) individually to external circuit components, and at least two gate terminal units (401-404) adapted for connecting the respective gates (110) of the at least two sub modules (101-106) individually to external circuit components.
Inventors:
Kotte, Didier
Asplund, Gunnar
Linder, Stephan
Asplund, Gunnar
Linder, Stephan
Application Number:
JP2011533717A
Publication Date:
July 08, 2015
Filing Date:
October 29, 2009
Export Citation:
Assignee:
ABB RESEARCH LTD.
International Classes:
H01L25/07; H01L25/18; H02M1/00
Domestic Patent References:
| JP2008085169A | ||||
| JP2008187151A | ||||
| JP11163257A | ||||
| JP2008259267A | ||||
| JP2006085169A |
Foreign References:
| US20080224323 |
Attorney, Agent or Firm:
Kurata Masatoshi
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Katsu Sunagawa
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Katsu Sunagawa