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Title:
CONNECTION BOARD AND MANUFACTURE THEREOF, DISPLAY DEVICE PROVIDED THEREWITH, AND MANUFACTURE OF DISPLAY DEVICE
Document Type and Number:
Japanese Patent JP3633203
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a connection board (heat seal) which connects a liquid crystal panel board mechanically and electrically to a circuit board together high in reliability by thermocompression bonding, even if the boards are equipped with terminals of different thickness at each edge of the heat seal.
SOLUTION: A display panel-side edge 24 of a heat seal 20 is equipped with a third terminal 26 provided with terminals 28, covered with a resin from outside the third terminal 26, and fixed to a first terminal 46 of a liquid crystal display panel 40 by pressure. A circuit board-side edge 30 of the heat seal 20 is equipped with a fourth terminal 32 provided with terminals, covered with a resin from outside the fourth terminal 32, and fixed to a second terminal 64 of a circuit board 60 by pressure. The display panel-side edge 24 and the circuit board-side edge 30 of the heat seal 20 are set differently in resin thickness from each other, corresponding to a thickness differently between the first terminal 46 of the liquid display panel 40 and the second terminal 64 of the circuit board 60.


Inventors:
Kazuaki Furuichi
Application Number:
JP12270697A
Publication Date:
March 30, 2005
Filing Date:
May 13, 1997
Export Citation:
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Assignee:
Seiko Epson Corporation
International Classes:
G02F1/1345; G09F9/35; H01R43/00; H05K1/14; H05K1/18; H05K3/32; H05K3/36; (IPC1-7): H05K1/18; G02F1/1345; G09F9/35; H01R12/06; H01R43/00; H05K1/14
Domestic Patent References:
JP6061642A
JP62055368U
JP61123571U
Attorney, Agent or Firm:
Inoue Ichi
Yukio Fuse
Mitsue Obuchi
Masahiko Ueyanagi
Osamu Suzawa