PURPOSE: To cure a bonding agent, to conduction-bond connection use circuits confronting each other and to fix the circuits by a method wherein a circuit board on one side of the connection use circuits is transparent, a reflector is provided on the periphery of the other connection use circuit and while the bonding agent is pinched by the connection use circuits, light is emitted through the rear of the transparent circuit board out of the connection use circuits confronting each other.

CONSTITUTION: Light is widely emitted on a bonding agent, which is pinched by connection use circuits while being applied a pressure from on an IC, through the rear of the glass of a liquid crystal panel. A reflector is provided on the periphery of a pressing tool, that is, the periphery of an IC chip. When a reflector is provided on the outside of the periphery of the IC chip, the light, which is once transmitted the glass on the periphery of the IC chip, is reflected by the reflectors, the light is again emitted on the peripheral part of the IC chip through the side of the surface of the glass this time, the light is again emitted on the bonding agent and the bonding agent on the peripheral part of the IC chip can be completely cured. Thereby, as the curing rate of the bonding agent on the periphery of an Au bump 6 is made uniform, the cure shrinkage force of the bonding agent is also improved its balance and the reliability of bonding of the connection use circuits confronting each other can be improved.