PURPOSE: To enable soldering without damage even if an interposed body is a plastic by connecting wirings of two electronic circuit boards by a solder- plated clip terminal and by heating the clip terminal from a transverse direction of the interposed body to melt solder plating.

CONSTITUTION: A glass substrate 16 is provided with a soldering electrode 50 and a plastic substrate 22 is provided with a soldering electrode 52. A clip terminal 30 is first formed to a lead frame shape and extends downward to be connected with a frame part. The clip terminal 30 is solderplated about 30 to 40μm thick. Solder storages 58, 60 are formed in be parts 36, 38 and molten solder stands there several times as thick as other parts by solder plating. Here, the clip terminal 30 is heated from a transverse direction of a housing by a heater 56. Then, heat of the clip terminal 30 flows up and down and the solder standing in the solder storages 58, 60 rapidly flows to soldering parts 32, 34 through the bent parts 36, 38. Soldering is carried out in this way.