Title:
コネクタ基板及びこれを用いたスピーカの入力端子の接続構造
Document Type and Number:
Japanese Patent JP4877001
Kind Code:
B2
Abstract:
In a connector substrate to which are soldered input terminals of a speaker and lead wires connected to an output terminal of a printed circuit board, the connector substrate is flat and approximately rectangular, and snap-off portions for, by being snapped off in a predetermined size, moving extreme positions of a longitudinal direction of the connector substrate, by a predetermined distance, toward an opposite extreme, are formed at either extreme of the longitudinal direction of the connector substrate.
Inventors:
Hiroyuki Ishibashi
Application Number:
JP2007078194A
Publication Date:
February 15, 2012
Filing Date:
March 26, 2007
Export Citation:
Assignee:
Funai Electric Co., Ltd.
International Classes:
H04R1/06; H04N5/64
Domestic Patent References:
| JP63065394U | ||||
| JP3126686U | ||||
| JP59078646U | ||||
| JP10178698A |
Attorney, Agent or Firm:
Shizuo Sano
Inoue On
Inoue On