To provide the connection structure of an electronic component lead to a conductive plate, wherein the electronic component lead is fixed to the conductive plate simultaneously with its mounting on a printed-circuit board, the number of man-hours can be reduced and there is no risk that unreasonable force is applied to the lead and an electronic component, when they are connected.

A hole 15 for the lead is formed in the conductive plate 1A, and a protrusion part 16 protruding from the circumference of the hole is formed. The protrusion part 16 is inserted into, and mounted on a hole 5a formed in the printed-circuit board 5. The lead 3 of the electronic component 2 is passed through, and inserted into the hole 15 in the conductive plate 1A, and the lead 3 is soldered (21) and connected to the protrusion part 16.