Title:
CONNECTION STRUCTURE OF METAL PART
Document Type and Number:
Japanese Patent JP2020017588
Kind Code:
A
Abstract:
To provide a connection structure of a metal part with a suitable back fillet of solder.SOLUTION: A connection structure of metal part 10 is obtained by joining a board 11 and a bus bar 12 inserted into a through hole 21 of the board 11 by solder 13. On a first surface 11a of the substrate 11, a top fillet 13a made of solder 13 is provided so as to surround the bus bar 12. On a second surface 11b of the substrate 11 opposite to the first surface 11a, a back fillet 13b made of solder 13 is provided so as to surround the bus bar 12. In a portion of the bus bar 12 protruding from the second surface 11b of the substrate 11, a hole 31 is provided immediately outside (immediately below) an ideal range L where the back fillet 13b is to be formed.SELECTED DRAWING: Figure 1
Inventors:
TACHI KOJI
YOSHIKAWA HIROSHI
MINAMIDA NAOTAKE
SATO HIROTO
TANIGAWA TAKAYA
YOSHIKAWA HIROSHI
MINAMIDA NAOTAKE
SATO HIROTO
TANIGAWA TAKAYA
Application Number:
JP2018138394A
Publication Date:
January 30, 2020
Filing Date:
July 24, 2018
Export Citation:
Assignee:
JTEKT CORP
International Classes:
H05K1/18; B23K1/00; F16B11/00
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Hironobu Onda