To provide a connection structure in which there is no unnecessary short-circuit between electrodes and which can securely connects wiring boards in a simple connection step.

There is provided a connection structure using a conductive particle for connecting wiring boards by providing a conductive particle (122) between electrodes (115a, 115b) opposed to each other and applying a magnetic field. A metal particle (120) having a magnetic property covered with an adhesive layer (121) is used as the conductive particle (122). The particle is pressed and heated in a state in which a magnetic field is applied to a predetermined electrode portion.