Title:
接続伝送線路共振ＲＦフィルタ
Document Type and Number:
Japanese Patent JP7008824
Kind Code:
B2
Abstract:
The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
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Inventors:
Fleming Jeb H.
McWessie Kyle
McWessie Kyle
Application Number:
JP2020531649A
Publication Date:
January 25, 2022
Filing Date:
December 13, 2018
Export Citation:
Assignee:
3D GLASS SOLUTIONS,INC
International Classes:
H01P11/00; H01P1/205
Domestic Patent References:
| JP2017516307A | ||||
| JP5206706A | ||||
| JP5160601A | ||||
| JP10022765A | ||||
| JP2013048489A | ||||
| JP8213874A | ||||
| JP2013141202A |
Attorney, Agent or Firm:
Hiroki Masaki
Teppei Hirota
Seiji Ozawa
Yusaku Tokai
Matsunashi Yasunori
Horiuchi Makoto
Masako Yamauchi
Shuichi Sonomoto
Akihiro Yamamura
Hiroyuki Tomita
Maki Shinoda
Teppei Hirota
Seiji Ozawa
Yusaku Tokai
Matsunashi Yasunori
Horiuchi Makoto
Masako Yamauchi
Shuichi Sonomoto
Akihiro Yamamura
Hiroyuki Tomita
Maki Shinoda