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Patent Searching and Data


Title:
CONNECTOR CONNECTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2012150953
Kind Code:
A
Abstract:

To solve such a problem that the mounting area increases because leads are provided in two places of the coupling terminal of a coupling connector and thereby two parts being attached to a printed wiring board are required per one signal, when the coupling connector is used as a method not performing wire bonding directly to the printed circuit board, and a connector and the coupling connector are connected by wire bonding but soldering, or the like, is used for connection of the coupling connector and the circuit board.

The surface electrode of a wire bond terminal component which is soldered to a printed circuit board attached to the bottom of a case in the same process as other electronic components and having the surface and rear surface connected electrically, and the electrode pin of a connector attached to the sidewall of the case are connected by wire bonding.


Inventors:
ISOBE YOSHIAKI
FUJIWARA HIROSUKE
Application Number:
JP2011007933A
Publication Date:
August 09, 2012
Filing Date:
January 18, 2011
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01R12/53; H01R12/71; H01R12/77
Domestic Patent References:
JPS62160468U1987-10-12
JPH0423063U1992-02-25
JPH10294395A1998-11-04
JP2005340647A2005-12-08
JP2010135712A2010-06-17
JP2007116077A2007-05-10
Attorney, Agent or Firm:
Shogo Takahashi
Tadahiko Inaba
Kanako Murakami
Nakatsuru Kazutaka