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Document Type and Number:
Japanese Patent JP2706651
Kind Code:

PROBLEM TO BE SOLVED: To improve the pin pressing-in strength and decrease the occurrence of a defective article at the time of assembling by blending specific quantities of epoxy alkoxy silane and an inorganic filler into a base material of a polyallylene sulfide resin.
SOLUTION: A polyallylene sulfide resin or its copolymer having the melt viscosity within the range of 100-5000 poises is suitable for the base material of a connector. A small quantity of a thermoplastic resin stable at a high temperature is concurrently used. For the material composition, epoxy alkoxy silane, e.g. γ-glycidoxypropyltrimethoxy silane, of 0.01-5 pts.wt. as a component is added and blended to the base resin of 100 pts.wt. An inorganic filler such as glass fibers or carbon black of 0-400 pts.wt. is blended according to the purpose. The composition mixed with them is molded by injection molding, and little burr is generated.

Toshikatsu Nito
Kiyoshi Nonaka
Application Number:
Publication Date:
January 28, 1998
Filing Date:
September 24, 1996
Export Citation:
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Polyplastics Co., Ltd.
Kureha Chemical Industry Co., Ltd.
International Classes:
B29C45/00; C08K3/00; C08K5/54; C08K5/5419; C08L81/02; H01B3/30; H01R13/46; B29K81/00; (IPC1-7): H01R13/46; B29C45/00; C08K3/00; C08K5/54; C08L81/02; H01B3/30
Domestic Patent References:
Attorney, Agent or Firm:
Furuya Kaoru