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Patent Searching and Data


Title:
CONSTITUTING METHOD OF SEMICONDUCTOR MANUFACTURING LINE
Document Type and Number:
Japanese Patent JPH06283591
Kind Code:
A
Abstract:

PURPOSE: To combine installations constituting a manufacturing line in a series of process units working formation layers, by arranging modules of installations combined in a series of working process units along the manufacturing flow of products, in the case of layout arrangement of a production line.

CONSTITUTION: Installations 55 is divided into a processing unit 52, a conveying unit 53 and a wafer delivering unit 54. The conveying unit 53 and the wafer delivering unit 54 are turned into sheets 56 and standards 57. For example, in a wiring film processing installation, a compound installation 50 wherein a pre-washing installation, a film forming installation and a drying installation are collected is constituted. The parts of the conveying unit 53 and the wafer delivering unit 54 are standardized. For example, in a photolithography process installation, a through installation 51 wherein a resist coating installation, an exposing installation and a developing installation are collected is constituted. Thereby arrangement installation is enabled more easily than individual installation arrangement.


Inventors:
KATAYANAGI TAKAHIRO
IWASAKI TAKEMASA
Application Number:
JP7150193A
Publication Date:
October 07, 1994
Filing Date:
March 30, 1993
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
C23C14/00; C23C14/50; H01L21/02; H01L21/677; H01L21/68; (IPC1-7): H01L21/68; C23C14/00; H01L21/02
Attorney, Agent or Firm:
Ogawa Katsuo