Title:
CONSTRUCTION FOR COOLING WIRING BOARD
Document Type and Number:
Japanese Patent JPS5411470
Kind Code:
A
More Like This:
JPH11204969 | ELECTRONIC DEVICE |
JPS59188198 | COOLING STRUCTURE OF ELETRONIC CIRCUIT PACKAGE |
Inventors:
NAITOU TADAO
SONODA MASAO
SAKAMURA TOSHIHIRO
OKADA NOBUHIDE
YAMADA YUUJI
MORI HIDEJI
SONODA MASAO
SAKAMURA TOSHIHIRO
OKADA NOBUHIDE
YAMADA YUUJI
MORI HIDEJI
Application Number:
JP7758477A
Publication Date:
January 27, 1979
Filing Date:
June 29, 1977
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H05K7/20; H01L23/46; H01L23/473; (IPC1-7): H01L23/46; H05K7/20