Title:
CONTACT ASSEMBLY
Document Type and Number:
Japanese Patent JP2022026508
Kind Code:
A
Abstract:
To improve a structure including a contact laminate forming a socket.SOLUTION: A contact assembly 1 includes a plurality of contacts 11 that form a socket S in a lamination state. Each of the contacts 11 includes a fitting part 12 that forms the socket S, and an engaged part 13 that is engaged in a lamination direction D1 of the contact 11. At least two contacts 11 among the contacts 11, which are adjacent to each other in the lamination direction D1, are made conductive electrically by a spring 131 that can apply pressure in the lamination direction D1 between the engaged parts 13.SELECTED DRAWING: Figure 1
Inventors:
TSUTSUI YUUKI
HOSHIBA NORITO
HOSHIBA NORITO
Application Number:
JP2020130027A
Publication Date:
February 10, 2022
Filing Date:
July 31, 2020
Export Citation:
Assignee:
TYCO ELECTRONICS JAPAN KK
International Classes:
H01R13/11; H01R25/16
Attorney, Agent or Firm:
Oba Mitsuru
Miyuki Horikawa
Miyuki Horikawa