Title:
Ａｇ合金を主成分とする接点用材料、該接点用材料を用いた接点、及び電気機器
Document Type and Number:
Japanese Patent JP7327476
Kind Code:
B2
Abstract:
A contact material reducing movement of oxides even when an arc is generated at the time of contact opening/closing to make the contacts less likely to be damaged is provided. A contact material mainly composed of an Ag alloy, includes: an Ag alloy; and at least one main additive existing as a phase different from the Ag alloy and selected from the group consisting of tin oxide, nickel, nickel oxide, iron, iron oxide, tungsten, tungsten carbide, tungsten oxide, zinc oxide, and carbon, wherein when a metal atom constituting the main additive or the main additive is carbon, the Ag alloy contains a solid solution element having a vacancy binding energy lower than a vacancy binding energy that is a binding energy between the metal atom included in the main additive and a vacancy in an Ag metal, or a binding energy between carbon included in the main additive of carbon and a vacancy in an Ag metal, in an amount of 0.01 wt.% or more.
Inventors:
Junichi Tanaka
Shuichi Triangle
Tetsuya Mori
Shuichi Triangle
Tetsuya Mori
Application Number:
JP2021522913A
Publication Date:
August 16, 2023
Filing Date:
May 29, 2020
Export Citation:
Assignee:
Omron Corporation
International Classes:
C22C32/00; C22C5/06
Domestic Patent References:
| JP6136472A | ||||
| JP2057649A | ||||
| JP2015125936A | ||||
| JP3215638A | ||||
| JP2015125935A | ||||
| JP9171735A |
Foreign References:
| CN108411135A | ||||
| KR1020110054625A |
Attorney, Agent or Firm:
Takuji Yamada
Hidehiro Tokuyama
Mitsuo Wada
Kazuhisa Inaba
Hidehiro Tokuyama
Mitsuo Wada
Kazuhisa Inaba