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Patent Searching and Data


Title:
CONTACT PIN ARRANGING METHOD AND IC SOCKET
Document Type and Number:
Japanese Patent JP2000150094
Kind Code:
A
Abstract:

To arrange one ends of contact pins in a matrix in the two dimensional direction at desirable pitches and provide a socket capable of assembling in a short time by stacking a plurality of contact pins to be arranged in parallel at desirable pitches within a single surface through a heat resistant, electrical insulating spacer.

By arranging the tip of a spring part 2b in each positioning groove of a spacer 7, dispersion of pitches in a spring part 2b is corrected, and the spring part 2b can correspond to the electrode pitch of a package. When lead frames are stacked through the spacer 7, a contact pin 2 in the stacking direction is positioned with a flat part 7a of the spacer 7 and correctly arranged, and short caused by contact of the contact pins can be prevented. When stacked 16 lead frames are fixed by arranging a fastening plate on opposite sides of a first fixing part 2c with a bolt, a plurality of contact pins 2 are accurately arranged in a matrix, and an aggregate of total 256 pins of 16×16 is obtained.


Inventors:
ONO KAZUTO
YUZAWA HITOSHI
SAKATA MASATO
Application Number:
JP32392398A
Publication Date:
May 30, 2000
Filing Date:
November 13, 1998
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
G01R31/26; H01R33/97; H01R33/76; (IPC1-7): H01R33/76; G01R31/26; H01R33/97
Attorney, Agent or Firm:
Koji Nagato