Title:
CONTACT PROBE, SEMICONDUCTOR ELEMENT SOCKET PROVIDED WITH CONTACT PROBE, AND METHOD FOR MANUFACTURING CONTACT PROBE
Document Type and Number:
Japanese Patent JP2013195282
Kind Code:
A
Abstract:
To provide a contact probe having a plunger whose outside shape is less distorted, a semiconductor element socket provided with the contact probe, and a method for manufacturing the contact probe.
A pair of projections 35 that projects inward in a radial direction is provided on the inner peripheral surface of a through hole 15 of a plunger 12 included in a contact probe 11. A coil spring 17 contacts the projections 35 at one end part so as to press an upper contactor 13 toward an electrode part 72 of a semiconductor element 73. For the plunger 12, an outer peripheral surface part corresponding to a part provided with the projections 35 in the inner peripheral surface of the through-hole 15 is flat.
Inventors:
MATSUZAWA HIROSHI
IKEGAMI YUKI
SUZUKI TAKESHI
SUZUKI KATSUMI
IKEGAMI YUKI
SUZUKI TAKESHI
SUZUKI KATSUMI
Application Number:
JP2012063903A
Publication Date:
September 30, 2013
Filing Date:
March 21, 2012
Export Citation:
Assignee:
YAMAICHI ELECTRONICS CO LTD
International Classes:
G01R1/067; G01R1/073; G01R31/26
Attorney, Agent or Firm:
Patent Business Corporation Tani/Abe Patent Office