Title:
接点構造、接点構造の製造方法、及び電磁リレー
Document Type and Number:
Japanese Patent JP6709953
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a contact structure, a contact structure manufacturing method and an electromagnetic relay that can further improve thermal conductivity from a contact portion to a conductive plate.SOLUTION: A contact structure 1a further includes a fillet portion 4 formed across a first surface 21 of a conductive plate 2 and a side surface 313 of a contact portion 31. The height of the fillet portion 4 from the first surface 21 gradually decreases as it goes away from the contact portion 31. The surface 411 of the outer peripheral portion 41 of the fillet portion 4 which is spaced apart from the contact portion 31 when viewed from the thickness direction of the conductive plate 2 is inclined with respect to the first surface 21 and formed of a part of the conductive plate 2 so that no step occurs between the fillet portion 4 and the first surface 21 in the direction away from the contact portion 31 along the first surface 21 of the conductive plate 2.SELECTED DRAWING: Figure 1
Inventors:
Okubayashi Keimi
Application Number:
JP2016082379A
Publication Date:
June 17, 2020
Filing Date:
April 15, 2016
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
H01H1/06; H01H11/06; H01H50/54
Domestic Patent References:
| JP7006651A | ||||
| JP58082726U | ||||
| JP2007122931A |
Attorney, Agent or Firm:
Patent business corporation Hokuto patent office
Keisei Nishikawa
Takeshi Sakaguchi
Hidetoshi Kitade
Nakaishi Haruki
Keisei Nishikawa
Takeshi Sakaguchi
Hidetoshi Kitade
Nakaishi Haruki