Title:
積層造形装置の制御方法
Document Type and Number:
Japanese Patent JP6477428
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a lamination molding apparatus capable of reducing a time required for raising of a collapse prevention wall and reducing a molding time.SOLUTION: A lamination molding apparatus is an apparatus for supplying and laminating powders in a molding tank 3, solidifying the laminated powder layers in a desired region, and forming a molded part which is formed into a desired shape, and a workpiece substrate which is a substrate of the molded part. The lamination molding apparatus comprises collapse prevention walls 201 and 202 for raising a height of a wall following to lamination of powders, for preventing collapse of the laminated powders, in the molding tank 3, in which rising speed of the collapse prevention walls 201 and 202 to an upper end of the workpiece substrate is higher than rising speed on a height of the molded part.SELECTED DRAWING: Figure 5
Inventors:
Keda Toka
Yoshiyuki Mitsuya
Seiji Niwa
Katsuhiro Ito
Harajiri Katsuji
Sawabe
Yoshiyuki Mitsuya
Seiji Niwa
Katsuhiro Ito
Harajiri Katsuji
Sawabe
Application Number:
JP2015219530A
Publication Date:
March 06, 2019
Filing Date:
November 09, 2015
Export Citation:
Assignee:
TOYOTA JIDOSHA KABUSHIKI KAISHA
International Classes:
B22F3/16; B22F3/105; B28B1/30; B29C64/245; B29C64/40; B33Y10/00
Domestic Patent References:
| JP2013526429A | ||||
| JP2010261072A | ||||
| JP2001334580A | ||||
| JP2011251529A |
Attorney, Agent or Firm:
Ken Ieiri