Title:
制御された滞留ＣＭＰ研磨法
Document Type and Number:
Japanese Patent JP7181009
Kind Code:
B2
Abstract:
The invention provides a method for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The method includes rotating a polishing pad, the rotating polishing pad having radial feeder grooves in the polishing layer separating the polishing layer into polishing regions. The polishing regions are circular sectors defined by two adjacent radial feeder grooves. The radial feeder grooves extend from a location adjacent the center to a location adjacent the outer edge. Each polishing region includes a series of biased grooves connecting a pair of adjacent radial feeder grooves. Pressing and rotating the wafer against the rotating polishing pad for multiple rotations of the polishing pad adjusts polishing by either increasing or decreasing residence time of the polishing fluid under the wafer.
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Inventors:
John Vu Nguyen
Tony Quang Trang
Jeffrey James Hendron
Jeffrey Robert Stack
Tony Quang Trang
Jeffrey James Hendron
Jeffrey Robert Stack
Application Number:
JP2018111063A
Publication Date:
November 30, 2022
Filing Date:
June 11, 2018
Export Citation:
Assignee:
Roam and Haas Electronic Materials CMP Holdings Incorporated
International Classes:
B24B37/26; B24B37/10; B24B37/24; H01L21/304
Domestic Patent References:
| JP2015533668A | ||||
| JP2007081322A |
Foreign References:
| US20080220702 | ||||
| US20090311955 |
Attorney, Agent or Firm:
Patent Attorney Corporation Tsukuni