To enable sure evaluation and analyzation of a same fault by providing means of getting an image of an scanning electronic microscope at an observation point from an external device and of displaying the image on a screen.

A defect position in a wafer is detected by a defect detector and it is stored as a data file. Then, the wafer is moved to a scanning electronic microscope(SEM) for observation/element analysys of an SEM image. A specified defect 50 is selected from defect information and SEM observation is carried out. The observed SEM image is stored as image information. Thereafter, the wafer is moved to a focusing ion beam device and the stage is moved to the same position as that of the SEM observed defect. After the movement of the stage, a scanning ion microscope image is obtaied and displayed on a screen. An SIM image 101 and the SEM image 102 are displayed on an FIB control screen 100. Accordingly, the shape of defect 50 can be confirmed by either one of the images to thereby attain the object.