Title:
CONVEYANCE METHOD OF SUBSTRATE, AND CONVEYANCE DEVICE OF THE SUBSTRATE
Document Type and Number:
Japanese Patent JP2017088356
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a conveyance method and a conveyance device which can minimize a contact surface of a substrate and a conveyance mechanism, and can stably convey without dropping the substrate during conveyance with a simple structure.SOLUTION: A conveyance method of a substrate includes: a substrate support process of supporting the substrate by pressing rollers and sandwiching from both side end parts of the substrate orthogonal to a conveyance direction of the substrate 101, wherein a pair of roller groups 201 are formed by linearly arranging a plurality of rollers, in which a center of an outer circumference part of a roller 201A is low and both ends in a width direction are high, in a same position in the conveyance direction; a substrate curving process of curving the substrate to convex upward by adjusting a distance between the pair of roller groups; an angle adjusting process of adjusting an angle formed between a tip end of both of the side end parts of the substrate and a rotation axis 202 of the respective contacting rollers to facilitate conveyance of the substrate in a plane orthogonal to the conveyance direction of the substrate; and a conveyance process of conveying the substrate by rotating the rollers.SELECTED DRAWING: Figure 2
Inventors:
NAGASHIMA KENTA
IMAMURA TOMOHIRO
IMAMURA TOMOHIRO
Application Number:
JP2015222796A
Publication Date:
May 25, 2017
Filing Date:
November 13, 2015
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD
International Classes:
B65G49/06; B65G13/00; B65G39/12; H01L21/677
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