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Title:
COOKING UTENSIL FOR FRYING
Document Type and Number:
Japanese Patent JP2012034736
Kind Code:
A
Abstract:

To provide a cooking utensil for frying thick vegetable tempura for obtaining thick vegetable tempura with better appearance and quality than a case using a conventional cooking utensil, and for improving manufacturing efficiency of thick vegetable tempura.

The cooking utensil for thick vegetable tempura 1 includes: a continuously mounting form unit 2; and a bottom plate unit 3. The continuously mounting form unit 2 includes: a continuously mounting form 4 with both end surfaces open, and with a plurality of cylinder forms having holes on a peripheral wall; a form support body 5 erected in connection with the end in the rear direction of the continuously mounting form. The bottom plate unit 3 includes: a bottom plate 10 having a multangular shape for covering the entire area of the bottom surface of the opening of the continuously mounting form unit 2, and having holes; and a bottom plate support body erected in connection with the end of the bottom plate 10. The continuously mounting form unit 2 is placed on the bottom plate 10 of the bottom plate unit 3, and can be separated from the bottom plate unit 3 when moving at least in a forward direction.


Inventors:
KAWAKITA HIROYUKI
KANAMORI KEIJI
Application Number:
JP2010175195A
Publication Date:
February 23, 2012
Filing Date:
August 04, 2010
Export Citation:
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Assignee:
SHOWA SANGYO CO
International Classes:
A47J37/12; A23L5/10
Attorney, Agent or Firm:
Kaoru Watanabe



 
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