COOLER FOR SEMICONDUCTOR CIRCUIT MODULE

Title:

COOLER FOR SEMICONDUCTOR CIRCUIT MODULE

Document Type and Number:

Japanese Patent JPS63263750

Kind Code:

A

Abstract:

An improved TCM-like circuit module for cooling an array of chips (14) mounted on a substrate (12). The substrate and the chips are enclosed by components that include a barrier plate (30) that separates the chip space (24) from a coolant (in 26) such as air or chilled water. A floating plate (37) contacts a heat transfer surface of each chip and forms a local heat sink. Pins (42, 43) conduct heat from the floating plate. In one embodiment, one end of each pin is rigidly attached to the floating plate and the other end is located in a cavity (40) in the barrier plate. In a second embodiment, the cavities are formed in the floating plate and the barrier plate rigidly supports the pins. In the second embodiment, the pins can be extended through the barrier plate to contact the coolant directly.

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Inventors:

RICHIYAADO CHIYAOOFUAN CHIYU
JIEFURII CHIYAARUZU AIDO
MITSUCHIERU RIN TSUMU TSUMUBUR

Application Number:

JP5856488A

Publication Date:

October 31, 1988

Filing Date:

March 14, 1988

Export Citation:

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Assignee:

IBM

International Classes:

H01L23/36; H01L23/433; H01L23/473; (IPC1-7): H01L23/36; H01L23/46

Attorney, Agent or Firm:

Jiro Yamamoto (1 person outside)

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