Title:
COOLER, SEMICONDUCTOR DEVICE, AND POWER CONVERTER
Document Type and Number:
Japanese Patent JP2022164355
Kind Code:
A
Abstract:
To provide a technique to efficiently cool a semiconductor package while the semiconductor package operates.SOLUTION: A cooler comprises: a plurality of perforated pipes that are provided side by side and separated in a first direction; a first header to which one ends of the plurality of perforated pipes are joined; and a second header that is provided separated from the first header in a second direction intersecting with the first direction and to which the other ends of the plurality of perforated pipes are joined. A first perforated pipe being any one of the plurality of perforated pipes has, at the one end of the first perforated pipe, a first inclined part inclined in the first direction with respect to the second direction, and has, at the other end of the first perforated pipe, a second inclined part inclined in the first direction with respect to the second direction.SELECTED DRAWING: Figure 1
Inventors:
SANUKI YASUTAKA
FUJIMOTO YUUJI
FUJIMOTO YUUJI
Application Number:
JP2021069794A
Publication Date:
October 27, 2022
Filing Date:
April 16, 2021
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H01L23/473; H01L25/07; H05K7/20
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito