Title:
COOLER
Document Type and Number:
Japanese Patent JP2017163028
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a cooler, the cooling capacity of which can be controlled without installing a temperature sensor.SOLUTION: A cooler 1 for cooling a semiconductor device, heat generation of which increases as the drive time increases, includes a flow path internally filled with refrigerant, two electrodes 12, 13 placed in the flow path, and control sections 30, 40 for moving the refrigerant in the flow path by applying a voltage to the two electrodes 12, 13, and cooling the semiconductor device by heat exchange of the refrigerant and semiconductor device. The control sections 30, 40 increase the flow rate of refrigerant, as the drive time of the semiconductor device increases.SELECTED DRAWING: Figure 3
Inventors:
KAKINISHI HIDETOSHI
RINNAI MASATO
UENO AKIFUMI
RINNAI MASATO
UENO AKIFUMI
Application Number:
JP2016047218A
Publication Date:
September 14, 2017
Filing Date:
March 10, 2016
Export Citation:
Assignee:
DENSO CORP
International Classes:
H01L23/473; H02K44/02
Attorney, Agent or Firm:
Patent Business Corporation Yuai Patent Office