Title:
電子部品用冷却装置および電子部品モジュール
Document Type and Number:
Japanese Patent JP4847359
Kind Code:
B2
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Inventors:
Yoshitaka Aragaki
Hikosaburo Hiraki
Satoru Nishimura
Hikosaburo Hiraki
Satoru Nishimura
Application Number:
JP2007019955A
Publication Date:
December 28, 2011
Filing Date:
January 30, 2007
Export Citation:
Assignee:
KOMATSU LTD.
International Classes:
H05K7/20; B60K11/04
Domestic Patent References:
| JP2004266247A | ||||
| JP7063453A |
Attorney, Agent or Firm:
Hiroaki Sakai