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Title:
COOLING DEVICE FOR BOARD
Document Type and Number:
Japanese Patent JP2015195247
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a cooling device for a board which reduces sound noise.SOLUTION: A cooling device for a board includes: a cooling unit 2; a heat radiation side heat sink 3 attached to the cooling unit 2; and a heat radiation side fan 5. An opening plate material 9 in which multiple opening holes are formed is disposed adjacent to the heat radiation side heat sink 3. It is preferable to dispose the opening plate material 9 between the heat radiation side heat sink 3 and the heat radiation side fan 5.

Inventors:
ITO KEISHIN
Application Number:
JP2014071519A
Publication Date:
November 05, 2015
Filing Date:
March 31, 2014
Export Citation:
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Assignee:
NITTO KOGYO KK
International Classes:
H05K7/20
Domestic Patent References:
JPH10225475A1998-08-25
JPH0645392U1994-06-14
Attorney, Agent or Firm:
Fumio Yamamoto
Tatsuo Watanuki
Yukine Sekine