Title:
COOLING DEVICE FOR ELECTRIC HEATING ELEMENT
Document Type and Number:
Japanese Patent JPH01192148
Kind Code:
A
Abstract:
PURPOSE:To prevent a potential from being applied to a metal block and heat pipes by a method wherein a high-heat conductivity electric insulator is arranged between an electric heating element and the metal block and conductor metals are each arranged integrally with both surfaces of the high-heat conductivity electric insulator. CONSTITUTION:Heat generated from a semiconductor element 1 is transmitted to a terminal 8, a conductor metal 10a, a high-heat conductivity electric insulator 9, a conductor metal 10b and a metal block 2 and moreover, is transmitted to each one end side 42 of heat pipes 4A, 4B and 4C via the wall surfaces of hole parts 3A, 3B and 3C and is transmitted to a coolant 41 encapsulated in the interiors of the pipes. As a result, the coolant 41 is boiled or evaporated to vaporize. A current to be made to flow through the element 1 is led out to the exterior through the terminal 8. Moreover, The block 2 and the pipes 4A, 4B and 4C are insulated electrically from the element 1 and the terminal 8 by the insulator 9 and no potential is applied to the block 2 and the heat pipes.
Inventors:
INOUE HITOSHI
KATAOKA KENJI
HANI KIYOSHI
FUJII MASAO
KATAOKA KENJI
HANI KIYOSHI
FUJII MASAO
Application Number:
JP1785888A
Publication Date:
August 02, 1989
Filing Date:
January 28, 1988
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01C7/04; H01B17/60; H01B19/02; H01L23/36; H01L23/40; H05K7/20; (IPC1-7): H01B17/60; H01B19/02; H01C7/04; H01L23/36; H01L23/40; H05K7/20
Domestic Patent References:
| JPS5989442A | 1984-05-23 | |||
| JPS5326865B2 | 1978-08-04 |
Attorney, Agent or Firm:
Takada Mamoru
Previous Patent: SUBSTRATE FOR SEMICONDUCTOR DEVICE
Next Patent: INTERLAMINAR COMPOUND AND ITS PRODUCTION
Next Patent: INTERLAMINAR COMPOUND AND ITS PRODUCTION