Title:
冷却装置及び多室型熱処理装置
Document Type and Number:
Japanese Patent JP6515370
Kind Code:
B2
Abstract:
A cooling apparatus (R) includes: cooling nozzles (2) which are disposed around an object (X) to be treated accommodated inside a cooling room (RS) and spray a cooling medium onto the object to be treated; a header pipe (3) communicating with the cooling nozzles; and a cooling pump (4) which supplies the cooling medium to the header pipe. The cooling nozzles are divided into groups. The header pipe is provided in each of the groups of the cooling nozzles.
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Inventors:
Kazuhiko Katsumata
Kaoru Isomoto
Takahiro Nagata
Nakayama
Yusuke Shimizu
Gen Nishitani
Kaoru Isomoto
Takahiro Nagata
Nakayama
Yusuke Shimizu
Gen Nishitani
Application Number:
JP2014111545A
Publication Date:
May 22, 2019
Filing Date:
May 29, 2014
Export Citation:
Assignee:
Ihi Co., Ltd.
Ihi Mechanical Systems Co., Ltd.
Ihi Mechanical Systems Co., Ltd.
International Classes:
C21D1/00
Domestic Patent References:
| JP2014095548A | ||||
| JP2007092088A | ||||
| JP2009113067A | ||||
| JP11254022A | ||||
| JP2007083287A | ||||
| JP8238518A | ||||
| JP7062426A | ||||
| JP2014051695A |
Foreign References:
| WO2012002532A1 |
Attorney, Agent or Firm:
Nishizawa Kazumi
Mitsuo Teramoto
Yuichiro Shimizu
Hisanori Takahashi
Mitsuo Teramoto
Yuichiro Shimizu
Hisanori Takahashi