Title:
COOLING DEVICE AND SPACE STRUCTURE
Document Type and Number:
Japanese Patent JP2023100293
Kind Code:
A
Abstract:
To provide a cooling device using a pump that can sufficiently secure the degree of supercooling of a refrigerant flowing into a pump while suppressing reduction in heat radiation capacity of a heat radiation part and entry of air bubbles into the pump.SOLUTION: A cooling device 100 comprises: a pump 1 for circulating a liquid refrigerant; and a refrigerant flow passage which is formed in an annular shape with a cooler 4 for cooling a power generation apparatus such as an electronic apparatus 2 with a refrigerant and a heat radiator 5 for cooling the refrigerant being sequentially connected in the passage. The heat radiator 5 comprises a condensation flow passage 6a into which the refrigerant flowing out of the cooler 4 enters and in which the entering refrigerant flows into a plurality of branched streams to radiate heat, and a sub-cool flow passage 7a into which refrigerant which has flown out of the condensation flow passage 6a enters and in which the entering refrigerant serially flows to radiate heat.SELECTED DRAWING: Figure 1
Inventors:
MORIYAMA TAKASHI
SAKAMOTO KENICHI
KATO KENJI
YAMADA TORU
SAITO TOMOHIKO
KUSASHIMA TATSUYA
SAKAMOTO KENICHI
KATO KENJI
YAMADA TORU
SAITO TOMOHIKO
KUSASHIMA TATSUYA
Application Number:
JP2022000826A
Publication Date:
July 19, 2023
Filing Date:
January 06, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
F25B39/04; F28D15/02; F25B40/02; H01L23/427; H05K7/20
Attorney, Agent or Firm:
Patent Attorney Corporation Cross Border Patent Office
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