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Title:
COOLING LIQUID FOR MACHINING AND MACHINING METHOD FOR METAL MATERIAL
Document Type and Number:
Japanese Patent JP2010132714
Kind Code:
A
Abstract:

To provide a grinding-cutting liquid easy to produce and excellent in cooling property and chip-removing property at low cost.

This grinding-cutting liquid is a cooling liquid for machining supplied to a part to be processed for cooling or removing chips at cutting or grinding processing of a metal material, which is water or an aqueous solution subjected to a reforming treatment so as to have reducing property in alkalinity to water by a method other than electrolysis. The water or aqueous solution subjected to a reforming treatment has a pH of 9.0 or more and an ORP of 0.0 mV or less, which is produced by subjecting water or an aqueous solution to a treatment of immersing in or contacting a treating material containing a mineral or a ceramic material possessing property of imparting reducing property in alkalinity to water or an aqueous solution by immersing therein or contacting it.

COPYRIGHT: (C)2010,JPO&INPIT


Inventors:
NISHIMURA NOBUAKI
TAKENOSHITA AKIRA
Application Number:
JP2008283961A
Publication Date:
June 17, 2010
Filing Date:
November 05, 2008
Export Citation:
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Assignee:
SEIWA TEKKO KK
International Classes:
C10M173/02; B23Q11/10; C10M103/00; C10N30/12; C10N40/22; C10N70/00
Attorney, Agent or Firm:
Makoto Kono