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Title:
COOLING MODULE
Document Type and Number:
Japanese Patent JP2007078306
Kind Code:
A
Abstract:

To provide a cooling module capable of improving the moldability of a tank part of a heat exchanger.

The cooling module has a radiator 1 provided with a radiator core 1a carrying out heat exchange between air and cooling water passing through an interior, and radiator tanks 1b provided on both ends of the radiator core 1a and sending and receiving the cooling water. A through-hole 10 is formed at the radiator tank 1b, and a condenser 2 is fixed to the radiator 1 via the through hole 10. By this, since it becomes unnecessary to provide a complicated part such as a pawl on the radiator tank 1b, the moldability of the radiator tank 1b can be improved.


Inventors:
MAEDA AKIHIRO
Application Number:
JP2005269748A
Publication Date:
March 29, 2007
Filing Date:
September 16, 2005
Export Citation:
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Assignee:
DENSO CORP
International Classes:
F28F9/26; B60H1/32; F28F9/02
Domestic Patent References:
JPH0579277U1993-10-29
JP3048561U1998-05-15
JPH09243289A1997-09-19
Attorney, Agent or Firm:
Yoji Ito
Takahiro Miura
Fumihiro Mizuno



 
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