Title:
COOLING PLATE AND PROJECTILE
Document Type and Number:
Japanese Patent JP2023181673
Kind Code:
A
Abstract:
To obtain a cooling plate that improves heat dissipation of an electronic device.SOLUTION: A cooling plate 7 cools an electronic device 6 provided inside a projectile. The cooling plate 7 includes a metal portion 71 that comes into contact with electronic device 6. The interior of the metal portion 71 includes a porous body 72 with communicating holes. The porous body 72 is in contact with the inner wall surface of the metal portion 71. The porous body 72 is formed such that the pore diameter changes. A refrigerant 8 is placed inside the porous body 72. A discharge port 74 capable of discharging the vaporized refrigerant 8 to the outside of the porous body 72 is formed in the metal portion 71.SELECTED DRAWING: Figure 3
Inventors:
IKEDA RYOTA
Application Number:
JP2022094933A
Publication Date:
December 25, 2023
Filing Date:
June 13, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/427; F28D15/02; F28D15/04; F28D15/06; H05K7/20
Attorney, Agent or Firm:
Yasutaka Kuratani
Shigeaki Matsui
Kenro Date
Shigeaki Matsui
Kenro Date