Title:
冷却装置
Document Type and Number:
Japanese Patent JP6699747
Kind Code:
B2
Abstract:
A cooling device (1) is provided with a cooler (2), a radiator (3), a heat-transfer body (5) and an insulation material (6). The cooler (2) has a heat-dissipating surface (2a) and a cooling surface (2b). The radiator (3) is provided on the heat-dissipating surface (2a). The heat-transfer body (5) is provided with a first heat-transfer part (8), a second heat-transfer part (9) and a third heat-transfer part (10). The first heat-transfer part (8) is provided on the cooling surface (2b). The third heat-transfer part (10) connects the first heat-transfer part (8) and the second heat transfer-part (9). The insulation material (6) covers at least the first heat-transfer part (8).
Inventors:
Yasutaka Ochiai
Mamoru Hamada
Akira Morii
Yuichiro Ito
Yosuke Izumo
High Hiroshiro No
Yuriko Arazu
Mamoru Hamada
Akira Morii
Yuichiro Ito
Yosuke Izumo
High Hiroshiro No
Yuriko Arazu
Application Number:
JP2018547029A
Publication Date:
May 27, 2020
Filing Date:
October 28, 2016
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
F25B21/02; F25D11/00
Domestic Patent References:
| JP10110961A | ||||
| JP11177264A | ||||
| JP2001148961A | ||||
| JP2001221551A | ||||
| JP2002139264A | ||||
| JP2004022603A | ||||
| JP59084386U |
Foreign References:
| WO2015125790A1 |
Attorney, Agent or Firm:
Mamoru Takada
Hideki Takahashi
Jiro Ozawa
Hideki Takahashi
Jiro Ozawa