Title:
冷却システム
Document Type and Number:
Japanese Patent JP6921196
Kind Code:
B2
Abstract:
A cooling system according to an embodiment of the present invention may comprise: a cooling part which supplies a cooling fluid to a strip; and a boiling film removal part, which physically comes into contact with the strip and removes a boiling film formed by the cooling fluid. The boiling film removal part according to the embodiment may be disposed at a position where a nuclear boiling and a film boiling are mixed together along a widthwise direction of the strip.
Inventors:
Lee, Pill-John
Seo, Jae-hyun
Ko, Sung-Hyun
Kang, John-Hung
Min, Gwang-Sik
Seo, Jae-hyun
Ko, Sung-Hyun
Kang, John-Hung
Min, Gwang-Sik
Application Number:
JP2019531762A
Publication Date:
August 18, 2021
Filing Date:
December 15, 2017
Export Citation:
Assignee:
POSCO
International Classes:
B21B45/02; B21B38/00; B21B38/02; B21C51/00; C21D9/573
Domestic Patent References:
| JP10323707A | ||||
| JP60074803U | ||||
| JP60009834A | ||||
| JP49017131B1 | ||||
| JP4279210A | ||||
| JP3084378A | ||||
| JP2101111A |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Masakazu Ito
Yuko Hara
Masakazu Ito
Yuko Hara