Title:
冷却装置
Document Type and Number:
Japanese Patent JP7049849
Kind Code:
B2
Abstract:
To provide a cooler capable of improving cooling performance furthermore.SOLUTION: A cooler 1 includes a casing 2 having a top wall 2a and a bottom wall 2b and provided with a cooling liquid passage 3 internally, and a radiator 4 provided in the casing 2. The radiator 4 is placed in the cooling liquid passage 3, and includes multiple metal fins 14 for receiving heat generated from an electrical heating element P attached to at least any one of the top wall 2a external surface and the bottom wall 2b external surface of the casing and releasing heat to the cooling liquid flowing in the cooling liquid passage 3, and a thermal diffusion plate 15 placed in the cooling liquid passage 3, and through which the fins 14 penetrate. The fins 14 and the thermal diffusion plate 15 are brought into thermal contact. Heat conductivity of the thermal diffusion plate 15 in the surface direction is set larger than that of Al. Furthermore, heat conductivity of the thermal diffusion plate 15 in the surface direction is set larger than heat conductivity in the thickness direction.SELECTED DRAWING: Figure 1
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Inventors:
Seiji Matsushima
Application Number:
JP2018023071A
Publication Date:
April 07, 2022
Filing Date:
February 13, 2018
Export Citation:
Assignee:
SHOWA DENKO K.K.
International Classes:
H01L23/473
Domestic Patent References:
| JP2018018877A | ||||
| JP2017007172A | ||||
| JP2012227365A |
Foreign References:
| WO2006051782A1 |
Attorney, Agent or Firm:
Yoshihito Shimizu
Hisayoshi Shimizu
Ken Takada
Kenfumi Sugiura
Hisayoshi Shimizu
Ken Takada
Kenfumi Sugiura
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