Title:
冷却装置
Document Type and Number:
Japanese Patent JP7059582
Kind Code:
B2
Abstract:
To provide a cooling device capable of improving cooling capacity to a cooling load while suppressing an increase in the size of the device.SOLUTION: A cooling device 100 includes: a high temperature side circuit 101 that is formed by connecting a compressor 10, a condenser 11, a main expansion valve 12, a sub expansion valve 13, a cascade heat exchanger 3 provided astride the high temperature side circuit 101 and a low temperature side circuit 102 and a supercooling device 4 provided astride the high temperature side circuit 101 and the low temperature side circuit 102 and disposed in parallel with the cascade heat exchanger 3 in the high temperature side circuit 101 by using refrigerant piping 1; and the low temperature side circuit 102 that is formed by connecting a compressor 20, the cascade heat exchanger 3, the supercooling device 4 and an expansion valve L1 by using refrigerant piping 2.SELECTED DRAWING: Figure 1
Inventors:
Yoshinari Oda
Application Number:
JP2017221426A
Publication Date:
April 26, 2022
Filing Date:
November 17, 2017
Export Citation:
Assignee:
Fuji Electric Co., Ltd.
International Classes:
F25B7/00; F25B1/00; F25B5/02; F25B6/04
Domestic Patent References:
| JP2015178920A |
Foreign References:
| WO2016185568A1 |
Attorney, Agent or Firm:
Hirokazu Miyazono