Title:
冷却装置
Document Type and Number:
Japanese Patent JP7366808
Kind Code:
B2
Abstract:
To reduce the size of a cooling device.SOLUTION: A cooling device 1 cools a heating element 2. The cooling device 1 includes a transmission portion 10 which is in contact with the heating element 2 and has a grid shape by a side wall portion 13 or the like, and a heat storage member 16 which is filled inside a grid-shaped space formed by the side wall portion 13 or the like. A refrigerant flow path 17 through which a refrigerant flows is formed inside the side wall portion 13 or the like. Further, in the cooling device 1, when the temperature of the side wall portion 13 or the like becomes lower than the temperature of the heat storage member 16, the heat stored in the heat storage member 16 is transferred to the refrigerant via the side wall portion 13 or the like.SELECTED DRAWING: Figure 1
Inventors:
Yoshitaka Nakayama
Tsutomu Kawamizu
Yuta Watanabe
Tsutomu Kawamizu
Yuta Watanabe
Application Number:
JP2020041764A
Publication Date:
October 23, 2023
Filing Date:
March 11, 2020
Export Citation:
Assignee:
MITSUBISHI HEAVY INDUSTRIES,LTD.
International Classes:
H01L23/473; H05K7/20
Domestic Patent References:
| JP2012069725A | ||||
| JP2003110070A | ||||
| JP2016186995A | ||||
| JP2010098004A | ||||
| JP63038245A |
Attorney, Agent or Firm:
Takaharu Fujita
Takaori Mitoma
Miki Kawakami
Daisuke Nagata
Takaori Mitoma
Miki Kawakami
Daisuke Nagata
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